DOD Announces $14 Million Agreement with Draper In Support of Computer Chips Advanced Packaging Solutions

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U.S. Department of Defense Releases

IMMEDIATE RELEASE
DOD Announces $14 Million Agreement With Draper in Support of Computer Chips Advanced Packaging Solutions
MARCH 2, 2021
The Defense Department entered into a $14 million agreement with Draper to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems.

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